B81B 7/0077
Other packages not provided for in groups b81b7/0035 - b81b7/0074
Official title: {Other packages not provided for in groups B81B7/0035 - B81B7/0074}
B81B7/0077 (Other packages not provided for in groups b81b7/0035 - b81b7/0074) appears on 297 US grants and 335 published applications in this corpus.
Search patents in B81B- Granted patents
- 297
- Published applications
- 335
- Assignees
- 158
- Inventors
- 659
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 2 |
| 2002 | 9 | 15 |
| 2003 | 13 | 14 |
| 2004 | 11 | 11 |
| 2005 | 13 | 30 |
| 2006 | 15 | 9 |
| 2007 | 6 | 14 |
| 2008 | 7 | 12 |
| 2009 | 10 | 4 |
| 2010 | 9 | 13 |
| 2011 | 7 | 10 |
| 2012 | 12 | 10 |
| 2013 | 7 | 16 |
| 2014 | 16 | 15 |
| 2015 | 15 | 19 |
| 2016 | 21 | 22 |
| 2017 | 14 | 15 |
| 2018 | 11 | 14 |
| 2019 | 19 | 15 |
| 2020 | 16 | 23 |
| 2021 | 13 | 13 |
| 2022 | 12 | 7 |
| 2023 | 7 | 7 |
| 2024 | 11 | 6 |
| 2025 | 4 | 11 |
| 2026 | 1 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- CMOS ultrasonic transducers and related apparatus and methods10 Mar 2026US 12,569,880 B2Bfly Operations, Inc.
- Waterproof mems pressure sensor package with a metal lid and an embedded ePTFE filter and process of making30 Sep 2025US 12,428,292 B2InvenSense, Inc.
- Micro-electromechanical packaging structure30 Sep 2025US 12,428,293 B2Merry Electronics(Shenzhen) Co., Ltd.
- MEMS resonator integrated cicruit fabrication22 Jul 2025US 12,365,582 B2SiTime Corporation
- Electrostatic device, electrostatic device intermediate body and production method4 Feb 2025US 12,215,019 B2Kabushiki Kaisha Saginomiya Seisakusho
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Micromechanical pressure sensor with enclosed housing wall23 Jul 2026US 2026/0209031 A1
- Cmos ultrasonic transducers and related apparatus and methods9 Jul 2026US 2026/0192332 A1Bfly Operations, Inc.
- Silicon-metal composite micro-electro-mechanical system-based material atmospheric corrosion sensor, preparation method therefor, and material atmospheric corrosion detection equipment25 Jun 2026US 2026/0176132 A1University of Science and Technology Beijing
- Sensor Module And Vehicle11 Jun 2026US 2026/0159378 A1Seiko Epson Corporation
Most cited
By later US patents
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006
- Miniature inductor for integrated circuits and devices167US 5,070,317 A1991
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby157US 6,777,767 B2Shellcase Ltd. · 2004
- Method of and apparatus for sealing an hermetic lid to a semiconductor die134US 6,303,986 B1Silicon Light Machines Corporation · 2001