Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
AssigneeShellcase Ltd.
InventorAvner Pierre Badehi
Life of this patent
Estimating the term…
Abstract
A crystalline substrate based device includes a crystalline substrate having formed thereon a microstructure, and a transparent packaging layer which is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the packaging layer. The microstructure receives light via the transparent packaging layer.
Claims40
A crystalline substrate based device comprising:
- a crystalline substrate having formed thereon a microstructure;
- and
- at least one transparent chip scale packaging layer which is sealed over said microstructure by means of an adhesive and defines therewith at least one gap between said crystalline substrate and said at least one transparent chip scale packaging layer, said crystalline substrate, said microstructure and said transparent chip scale packaging layer forming a chip scale package,
- wherein said microstructure receives light via said at least one transparent chip scale packaging layer.
A chip scale packaged crystalline substrate comprising:
- a substrate having formed thereon a microstructure;
- and
- at least one chip scale package which is sealed over said microstructure and defines therewith at least one gap,
- and wherein said at least one package is at least partially transparent.
A chip scale packaged crystalline substrate based device comprising:
- a crystalline substrate having formed thereon a microstructure;
- and
- at least one chip scale package comprising at least one transparent packaging layer which is sealed over said microstructure by means of an adhesive and defines therewith at least one gap between said crystalline substrate and said at least one transparent packaging layer,
- wherein said microstructure receives light via said at least one transparent packaging layer.
A crystalline substrate based device comprising:
- a crystalline substrate having formed thereon a microstructure;
- and
- at least one chip scale packaging layer which is sealed over said microstructure and defines therewith at least one gap between said crystalline substrate and said at least one chip scale packaging layer, the crystalline substrate, microstructure and chip scale packaging layer forming a chip scale package,
- the chip scale package having a multiplicity of electrical contacts plated along edge surfaces thereof.
A crystalline substrate based device comprising:
- a microstructure on a substrate;
- and
- a spacer on said substrate, said spacer defining at least one cavity extending entirely therethrough;
- and
- at least one transparent packaging layer adhesively sealed onto said spacer over said microstructure and at least partially spaced therefrom, thereby to define a gap at said at least one cavity between said microstructure and said at least one packaging layer, wherein the substrate, microstructure and packaging layer form a chip scale package having a multiplicity of electrical contacts plated along edge surfaces thereof.
A crystalline substrate based device comprising:
- a microstructure on a substrate;
- and
- at least one packaging layer;
- a spacer on said packaging layer, said spacer defining at least one cavity extending entirely therethrough;
- and
- said at least one packaging layer adhesively sealed onto said spacer over said microstructure and at least partially spaced therefrom, thereby to define a gap at said at least one cavity between said microstructure and said at least one packaging layer, wherein the substrate, microstructure and packaging layer form a chip scale package having a multiplicity of electrical contacts plated along edge surfaces thereof.
Dependencies are inferred from the claim text.