Method of and apparatus for sealing an hermetic lid to a semiconductor die

A microelectronic machine (MEM) having an hermetic seal comprising:

• a. a substrate on which is formed an active MEM device;
• b. a lid sealing region surrounding the active MEM device;
• c. a first layer of solderable material formed over the lid sealing region wherein the first layer of solderable material is a sandwich comprising chrome adjacent the lid sealing region and palladium adjacent the solder;
• d. a layer of solder formed over the first layer of solderable material;
• e. a second layer of solderable material formed over the solder;
• and
• f. a lid formed over the second layer of solderable material forming an hermetic seal thereby.

A microelectronic machine (MEM) having an hermetic seal comprising:

• a. a substrate on which is formed an active MEM device;
• b. a lid sealing region surrounding the active MEM device;
• c. a first layer of solderable material formed over the lid sealing region wherein the first layer of solderable material is a sandwich comprising titanium adjacent the lid sealing region, nickel adjacent the titanium and platinum between the nickel and the solder;
• d. a layer of solder formed over the first layer of solderable material;
• e. a second layer of solderable material formed over the solder;
• and
• f. a lid formed over the second layer of solderable material forming an hermetic seal thereby.

A display device comprising:

• a. a light modulator formed on a semiconductor substrate;
• b. a lid sealing region surrounding the light modulator and having a passivation layer formed thereon;
• c. a plurality of bond pads positioned adjacent the lid sealing region and away from the light modulator;
• d. a first layer of solderable material formed over the lid sealing region;
• e. a layer of solder formed over the first layer of solderable material;
• f. a second layer of solderable material formed over the solder;
• and
• g. a transparent lid formed over the second layer of solderable material forming an hermetic seal thereby, wherein the passivation layer is configured to position the lid a finite distance from the light modulator.

A display device comprising:

• a. light modulator formed on a semiconductor substrate;
• b. a lid sealing region surrounding the light modulator;
• c. a plurality of bond pads positioned adjacent the lid sealing region and away from the light modulator;
• d. a first layer of solderable material formed over the lid sealing region wherein the first layer of solderable material is a sandwich comprising chrome adjacent the lid sealing region and palladium adjacent the solder;
• e. a layer of solder formed over the first layer of solderable material;
• f. a second layer of solderable material formed over the solder;
• and
• g. a transparent lid formed over the second layer of solderable material forming an hermetic seal thereby.

A display device comprising:

• a. a light modulator formed on a semiconductor substrate;
• b. a lid sealing region surrounding the light modulator;
• c. a plurality of bond pads positioned adjacent the lid sealing region and away from the light modulator;
• d. a first layer of solderable material formed over the lid sealing region wherein the first layer of solderable material is a sandwich comprising titanium adjacent the lid scaling region, nickel adjacent the titanium and platinum between the nickel and the solder;
• e. layer of solder formed over the first layer of solderable material;
• f. a second layer of solderable material formed over the solder;
• and
• g. a transparent lid formed over the second layer of solderable material forming an hermetic seal thereby.

A microelectronic machine (MEM) having an hermetic seal comprising:

• a. a substrate on which is formed an active MEM device;
• b. a lid sealing region surrounding the active MEM device and having a passivation layer formed thereon;
• c. a layer glass frit formed over the lid sealing region;
• and
• d. a lid formed over the layer of glass frit forming an hermetic seal thereby, wherein the passivation layer is configured to position the lid a finite distance from the active MEM device.

A display device comprising:

• a. a light modulator formed on a semiconductor substrate;
• b. a lid sealing region surrounding the light modulator and having a passivation layer formed thereon;
• c. a plurality of bond pads positioned adjacent the lid sealing region and away from the light modulator;
• d. a layer of glass frit formed over the lid sealing region;
• and
• e. a transparent lid formed over the layer of glass frit forming an hermetic seal thereby, wherein the passivation layer is configured to position the lid a finite distance from the light modulator.

An optical device comprising:

• a. a MEM formed on a semiconductor substrate;
• b. a lid sealing region surrounding the MEM and having a passivation layer formed thereon;
• c. a plurality of bond pads positioned adjacent the lid scaling region and away from the MEM;
• d. a first layer of solderable material formed over the lid sealing region;
• e. a layer of solder formed over the first layer of solderable material;
• f. a second layer of solderable material formed over the solder;
• and
• g. a transparent lid formed over the second layer of solderable material forming an hermetic seal thereby, wherein the passivation layer is configured to position the lid a finite distance from the MEM.

An optical device comprising:

• a. a MEM formed on a semiconductor substrate;
• b. a lid sealing region surrounding the MEM;
• c. a plurality of bond pads positioned adjacent the lid sealing region and away from the MEM;
• d. a first layer of solderable material formed over the lid sealing region wherein the first layer of solderable material is a sandwich comprising chrome adjacent the lid sealing region and palladium adjacent the solder;
• e. a layer of solder formed over the first layer of solderable material;
• f. a second layer of solderable material formed over the solder;
• and
• g. a transparent lid formed over the second layer of solderable material forming an hermetic seal thereby.

An optical device comprising:

• a. a MEM formed on a semiconductor substrate;
• b. a lid sealing region surrounding the MEM;
• c. a plurality of bond pads positioned adjacent the lid sealing region and away from the MEM;
• d. a first layer of solderable material formed over the lid sealing region wherein the first layer of solderable material is a sandwich comprising titanium adjacent the lid sealing region, nickel adjacent the titanium and platinum between the nickel and the solder;
• e. a layer of solder formed over the first layer of solderable material;
• f. a second layer of solderable material formed over the solder;
• and
• g. a transparent lid formed over the second layer of solderable material forming an hermetic seal thereby.

An optical device comprising:

• a. a MEM formed on a semiconductor substrate;
• b. a lid sealing region surrounding the MEM and having a passivation layer formed thereon;
• c. a plurality of bond pads positioned adjacent the lid sealing region and away from the MEM;
• d. a layer of glass frit formed over the lid sealing region;
• and
• e. a transparent lid formed over the layer of glass frit forming an hermetic seal thereby wherein the passivation layer is configured to position the lid a finite distance from the MEM.