Waterproof mems pressure sensor package with a metal lid and an embedded ePTFE filter and process of making

A method of making a microelectromechanical system (MEMS) package, the method comprising:

• forming a lid comprising a body portion and a ceiling portion such that the body portion and the ceiling portion form a cavity in which at least one MEMS device is configured to be enclosed;
• forming a membrane from a filtering fabric;
• disposing the membrane on the ceiling portion such that the membrane is in contact with the ceiling portion, the membrane configured to substantially block one or more of liquids and contaminants from passing into the cavity;
• disposing the lid on a base substrate such that the body portion of the lid is coupled to the base substrate, the base substrate including the at least one MEMS device disposed thereon;
• providing first and second ceiling layers, the first and second ceiling layers forming the ceiling portion;
• and
• coupling the ceiling portion to the body portion,
• wherein the disposing of the membrane further comprises embedding the membrane between the first and second ceiling layers, and
• wherein the first and second ceiling layers are adhered together without adhering the membrane to the first and second ceiling layers.

A method of manufacturing a plurality of housing packages, each housing package configured to enclose a microelectromechanical system (MEMS) device, the method comprising:

• providing a first ceiling layer having a matrix of first ceiling components, each of said first ceiling components having one or more first holes arranged in a first pattern;
• providing a second ceiling layer having matrix of second ceiling components, each of said second ceiling components having one or more second holes arranged in the first pattern;
• providing a membrane layer comprising a filtering fabric;
• embedding the membrane layer between the first ceiling layer and the second ceiling layer such that the matrix of first ceiling components align with the matrix of second ceiling components, to form a third ceiling layer;
• separating the third ceiling layer to form a plurality of ceiling portions corresponding to the plurality of housing packages;
• and
• coupling the plurality of ceiling portions to a plurality of base portions to form the plurality of housing packages.