B81B 7/0067
For controlling the passage of optical signals through the package
Official title: {for controlling the passage of optical signals through the package}
B81B7/0067 (For controlling the passage of optical signals through the package) appears on 160 US grants and 193 published applications in this corpus.
Search patents in B81B- Granted patents
- 160
- Published applications
- 193
- Assignees
- 93
- Inventors
- 346
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 1 |
| 2002 | 5 | 11 |
| 2003 | 7 | 2 |
| 2004 | 9 | 8 |
| 2005 | 4 | 7 |
| 2006 | 7 | 12 |
| 2007 | 5 | 7 |
| 2008 | 0 | 7 |
| 2009 | 4 | 6 |
| 2010 | 4 | 5 |
| 2011 | 4 | 2 |
| 2012 | 3 | 4 |
| 2013 | 3 | 4 |
| 2014 | 4 | 4 |
| 2015 | 4 | 8 |
| 2016 | 8 | 10 |
| 2017 | 8 | 9 |
| 2018 | 10 | 13 |
| 2019 | 5 | 12 |
| 2020 | 16 | 16 |
| 2021 | 7 | 14 |
| 2022 | 8 | 11 |
| 2023 | 12 | 5 |
| 2024 | 11 | 9 |
| 2025 | 7 | 4 |
| 2026 | 5 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Wafer level vacuum packaging (WLVP) of thermal imaging sensor19 May 2026US 12,631,491 B2Meridian Innovation Pte Ltd
- MEMS packaging enabling vertical displacement of sensor and actuator rotor17 Feb 2026US 12,552,663 B2Connaught Electronics Ltd.
- Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface3 Feb 2026US 12,540,070 B2STMicroelectronics S,r.l.
- Generating a MEMS device with glass cover and MEMS device27 Jan 2026US 12,534,360 B2Infineon Technologies AG
- Generating a mems device with glass cover and mems device4 Jun 2026US 2026/0152389 A1Infineon Technologies AG
- Dielectric stack for microelectromechanical system devices and methods of fabrication thereof30 Apr 2026US 2026/0116740 A1Texas Instruments Incorporated
- Method for producing a composite cap element, and composite cap element5 Jun 2025US 2025/0178888 A1Schott AG
- Cover glass with outer frame, semiconductor light emitting device, and semiconductor light receiving device29 May 2025US 2025/0176324 A1AGC Inc.
- Mems packaging enabling vertical displacement of sensor and actuator rotor24 Apr 2025US 2025/0128936 A1Connaught Electronics Ltd.
Most cited
By later US patents
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Microelectronic device package with an integral window238US 6,384,473 B1Sandia Corporation · 2002
- Single level microelectronic device package with an integral window236US 6,661,084 B1Sandia Corporation · 2003
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby157US 6,777,767 B2Shellcase Ltd. · 2004
- Multilayered microelectronic device package with an integral window133US 6,538,312 B1Sandia Corporation · 2003