MEMS packaging enabling vertical displacement of sensor and actuator rotor

A MEMS device comprising:

• an electrical distribution substrate;
• an actuator stator supported to and above the electrical distribution substrate, the actuator stator having a floor and an outer frame extending upward from the floor;
• an actuator rotor suspended above the floor of the actuator stator and within the outer frame;
• a lower ring extending upward from the electrical distribution substrate, wherein the lower ring is located radially outward from the outer frame of the actuator stator;
• an upper ring vertically aligned with the lower ring;
• a sensor connected to the rotor such that the sensor and the rotor can move vertically relative to the stator;
• a wire bond interconnect electrically connecting the sensor to the upper ring;
• and
• a via extending through the lower ring and to the electrical distribution substrate;
• wherein an electrical connection is provided between the sensor and the electrical distribution substrate due to an electrical pathway defined by the wire bond interconnect, the upper ring, and the via.

A MEMS device comprising:

• a Redistribution Layer (RDL) substrate;
• a spacer ring extending vertically from the RDL substrate and having a plurality of vias extending therethrough and in electrical communication with the RDL substrate;
• a stack including copper and laminate and forming a ring, the stack electrically coupled to the RDL substrate by way of the vias;
• a MEMS actuator having a stator mounted to the RDL substrate and within the spacer ring, the MEMS actuator further having a rotor suspended above the stator and configured to translate vertically relative to the stator;
• a sensor supported above the rotor and configured to translate vertically along with the rotor;
• and
• a wire electrically connecting the sensor to the stack.