H05K 2203/03
Metal processing
H05K2203/03 (Metal processing) appears on 2,338 US grants and 1,963 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,338
- Published applications
- 1,963
- Assignees
- 757
- Inventors
- 4,597
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 8 | 0 |
| 1978 | 9 | 0 |
| 1979 | 8 | 0 |
| 1980 | 12 | 0 |
| 1981 | 5 | 0 |
| 1982 | 9 | 0 |
| 1983 | 20 | 0 |
| 1984 | 21 | 0 |
| 1985 | 26 | 0 |
| 1986 | 16 | 0 |
| 1987 | 19 | 0 |
| 1988 | 17 | 0 |
| 1989 | 22 | 0 |
| 1990 | 29 | 0 |
| 1991 | 36 | 0 |
| 1992 | 43 | 0 |
| 1993 | 45 | 0 |
| 1994 | 44 | 0 |
| 1995 | 42 | 0 |
| 1996 | 49 | 0 |
| 1997 | 48 | 0 |
| 1998 | 69 | 0 |
| 1999 | 75 | 0 |
| 2000 | 78 | 0 |
| 2001 | 99 | 63 |
| 2002 | 100 | 100 |
| 2003 | 94 | 90 |
| 2004 | 76 | 103 |
| 2005 | 70 | 109 |
| 2006 | 66 | 106 |
| 2007 | 71 | 127 |
| 2008 | 63 | 145 |
| 2009 | 73 | 158 |
| 2010 | 90 | 131 |
| 2011 | 99 | 108 |
| 2012 | 100 | 87 |
| 2013 | 72 | 62 |
| 2014 | 70 | 83 |
| 2015 | 51 | 67 |
| 2016 | 49 | 61 |
| 2017 | 57 | 54 |
| 2018 | 52 | 42 |
| 2019 | 47 | 40 |
| 2020 | 42 | 39 |
| 2021 | 29 | 37 |
| 2022 | 30 | 28 |
| 2023 | 21 | 27 |
| 2024 | 22 | 46 |
| 2025 | 19 | 33 |
| 2026 | 16 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/0315Oxidising metalIndexing code484
- H05K 2203/0338Transferring metal or conductive material other than a circuit patternIndexing code454
- H05K 2203/0307Providing micro- or nanometer scale roughness on a metal surfaceIndexing code413
- H05K 2203/0369Etching selective parts of a metal substrate through part of its thicknessIndexing code275
- H05K 2203/0361Stripping a part of an upper metal layer to expose a lowerIndexing code229
- H05K 2203/0384Etch stop layer, i.e. a buried barrier layer for preventing etching ofIndexing code169
- H05K 2203/0353Making conductive layer thinIndexing code143
- H05K 2203/0323Working metal substrate or coreIndexing code140
Recent patents
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Micro circuit structure and manufacturing method thereof1 Sep 2026US 12,727,077 B2Kinsus Interconnect Technology Corp.
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Memory device with emi shield1 Oct 2026US 2026/0304600 A1Micron Technology, Inc.
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Method of manufacturing multilayer pcb for semiconductor testing and multilayer pcb manufactured thereby27 Aug 2026US 2026/0255494 A1Tes Co., Ltd
- Carrier for laser induced forward transfer and transfer apparatus comprising the same13 Aug 2026US 2026/0233341 A1Nexperia B. V.
Most cited
By later US patents
- Etching method and etching apparatus343US 9,991,138 B2Tokyo Electron Limited · 2018
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991