Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil
AssigneeFukuda Metal Foil & Powder Co., Ltd.
InventorsTakeshi Okamoto, Kenta Miyamoto
Life of this patent
Estimating the term…
Abstract
A surface-treated copper foil includes a roughening treatment layer on at least one surface of an untreated copper foil, a heat-resistant treatment layer on the roughening treatment layer, and a chromate treatment layer on the heat-resistant treatment layer. The roughening treatment layer is formed of copper particles having a primary particle size of 0.5 μm or more and 0.9 μm or less. The heat-resistant treatment layer is a heat-resistant treatment layer containing cobalt and molybdenum. The chromate treatment layer has a treatment surface with a gloss Gs (85°) of 60 or more and 80 or less.
Claims6
A surface-treated copper foil comprising a roughening treatment layer on at least one surface of an untreated copper foil, a heat-resistant treatment layer on the roughening treatment layer, and a chromate treatment layer on the heat-resistant treatment layer, the roughening treatment layer being formed of copper particles having a primary particle size of 0.5 μm or more and 0.9 μm or less, the heat-resistant treatment layer being a heat-resistant treatment layer containing cobalt and molybdenum, the chromate treatment layer having a treatment surface with a gloss Gs (85°) of 60 or more and 80 or less.
Dependencies are inferred from the claim text.