H05K 2203/0376
Etching temporary metallic carrier substrate
H05K2203/0376 (Etching temporary metallic carrier substrate) appears on 140 US grants and 124 published applications in this corpus.
Search patents in H05K- Granted patents
- 140
- Published applications
- 124
- Assignees
- 76
- Inventors
- 308
- Latest grant
- 16 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 2 |
| 2002 | 5 | 4 |
| 2003 | 2 | 4 |
| 2004 | 3 | 8 |
| 2005 | 4 | 5 |
| 2006 | 8 | 4 |
| 2007 | 3 | 9 |
| 2008 | 6 | 16 |
| 2009 | 4 | 13 |
| 2010 | 8 | 9 |
| 2011 | 6 | 6 |
| 2012 | 9 | 7 |
| 2013 | 8 | 5 |
| 2014 | 3 | 7 |
| 2015 | 6 | 4 |
| 2016 | 5 | 5 |
| 2017 | 4 | 5 |
| 2018 | 6 | 4 |
| 2019 | 2 | 1 |
| 2020 | 3 | 1 |
| 2021 | 2 | 1 |
| 2022 | 2 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 2 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
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- Catalyzed metal foil and uses thereof19 Aug 2021US 2021/0259115 A1Averatek Corporation
Most cited
By later US patents
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Method of making multilayered substrate for semiconductor device101US 6,418,615 B1Shinko Electronics Industries, Co., Ltd. · 2002
- Method for fabricating a wiring substrate by electroplating a wiring film on a metal base99US 6,782,610 B1North Inc. · 2004
- Process for manufacturing panels to be used in microelectronic systems82US 4,404,059 A1983
- Multi-layer flexible film module68US 4,480,288 AInternational Business Machines Corporation · 1984