Manufacturing method for printed circuit board

A manufacturing method for a printed circuit board, comprising:

• laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with the insulating layer;
• pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
• removing the first metal layer such that the first surface of the second metal layer is exposed;
• and
• treating the first surface of the second metal layer with an acidic solution such that at least a portion of the second metal layer is removed,
• wherein the second surface of the second metal layer is in contact with an entire surface of the insulating layer after the treating.

A manufacturing method for a printed circuit board, comprising:

• laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with a surface of the insulating layer;
• pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
• removing the first metal layer such that the first surface of the second metal layer is exposed;
• and
• coating the first surface of the second metal layer with an acidic solution such that the second metal layer with a uniform thickness is continuously disposed on the insulating layer.