Catalyzed metal foil and uses thereof
AssigneeAveratek Corporation
InventorShinichi Iketani
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Abstract
Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.
Claims18
A method of forming an electrical circuit comprising a substrate using a metal foil, the method comprising:
- laminating a film to a surface of the substrate;
- laminating a surface of the metal foil to the film;
- removing the metal foil to expose a portion of the film or substrate;
- and
- depositing a first conductor to the portion of the film or substrate;
- wherein at least one of the film or substrate or metal foil is treated with a dry chemical treatment, wherein the dry chemical treatment comprises a corona discharge, or an electron beam;
- wherein the laminating surface of the metal foil is roughened by chemical etching to form an average roughness (Ra) between 0.1 μm or more to 0.5 μm or less.
Dependencies are inferred from the claim text.