Method for producing wiring circuit board
AssigneeNitto Denko Corporation
InventorsHayato TAKAKURA, Naoki SHIBATA, Rei FUKUI, Tomoaki TANAKA
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Abstract
A method for producing a wiring circuit board includes a first step of setting a pattern forming region and an opening forming region in a supporting layer; a second step of forming a base insulating layer on the supporting layer at least in the pattern forming region; a third step of forming, by electrolytic plating, a conductive pattern on the base insulating layer in the pattern forming region and a dummy pattern in the opening forming region; and a fourth step of etching at least a portion of the supporting layer in the opening forming region.
Claims5
A method for producing a wiring circuit board, comprising:
- a first step of setting a pattern forming region and an opening forming region in a supporting layer;
- a second step of forming an insulating layer on the supporting layer at least in the pattern forming region;
- a third step of forming, by electrolytic plating, a conductive pattern on the insulating layer in the pattern forming region and a dummy pattern in the opening forming region;
- and
- a fourth step of etching at least a portion of the supporting layer in the opening forming region.
Dependencies are inferred from the claim text.