Method for producing wiring circuit board

A method for producing a wiring circuit board comprising:

• a preparation step of preparing a substrate made of a first metal;
• a metal layer forming step of forming a metal layer made of a second metal different from the first metal on one side of the substrate in a thickness direction;
• a first patterning step of forming an insulating layer on one side of the metal layer in the thickness direction;
• a second patterning step of forming a conductive pattern on one side of the insulating layer in the thickness direction, the conductive pattern having a first terminal, a second terminal, a first wiring connected to the first terminal, and a second wiring connected to the second terminal and disposed spaced from the first wiring;
• a removing step of removing the substrate and exposing at least a portion of the metal layer after the second patterning step;
• and
• a deposition step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer having a terminal support portion supporting the first terminal and the second terminal, a first wiring support portion supporting the first wiring, and a second wiring support portion supporting the second wiring and disposed spaced from the first wiring support portion after the removing step.