H05K 2203/0369
Etching selective parts of a metal substrate through part of its thickness
Official title: Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
H05K2203/0369 (Etching selective parts of a metal substrate through part of its thickness) appears on 275 US grants and 303 published applications in this corpus.
Search patents in H05K- Granted patents
- 275
- Published applications
- 303
- Assignees
- 126
- Inventors
- 540
- Latest grant
- 25 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 11 |
| 2002 | 10 | 11 |
| 2003 | 10 | 13 |
| 2004 | 11 | 20 |
| 2005 | 13 | 19 |
| 2006 | 10 | 19 |
| 2007 | 9 | 17 |
| 2008 | 14 | 14 |
| 2009 | 12 | 24 |
| 2010 | 16 | 42 |
| 2011 | 20 | 28 |
| 2012 | 27 | 12 |
| 2013 | 15 | 7 |
| 2014 | 9 | 10 |
| 2015 | 8 | 8 |
| 2016 | 4 | 4 |
| 2017 | 6 | 11 |
| 2018 | 10 | 3 |
| 2019 | 4 | 5 |
| 2020 | 3 | 2 |
| 2021 | 4 | 3 |
| 2022 | 1 | 6 |
| 2023 | 1 | 3 |
| 2024 | 5 | 4 |
| 2025 | 3 | 7 |
By publication year. Applications have been published since 2001.
Recent patents
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- Component Carrier, Method and Apparatus for Manufacturing the Component Carrier13 Nov 2025US 2025/0351268 A1AT&S (Chongqing) Company Limited
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Most cited
By later US patents
- Manufacturing methods for printed circuit boards142US 6,902,869 B2International Business Machines Corporation · 2005
- Method of manufacture of ceramic composite wiring structures for semiconductor devices100US 7,047,637 B22006
- Membrane probe with anchored elements94US 7,011,531 B2International Business Machines Corporation · 2006
- Metal substrated printed circuit91US 4,858,073 AAkzo America Inc. · 1989
- Manufacturing method of a probe head for semiconductor LSI inspection apparatus89US 5,191,708 AHitachi, Ltd. · 1993