US 5,191,708 A · Manufacturing method of a probe head for semiconductor LSI inspection apparatus

Abstract

The present invention relates to a manufacturing method of a probe head for an inspection apparatus of a semiconductor device represented by an LSI, and more particularly to a manufacturing method suitable for forming probes with high accuracy in forming into multipins at high density, and is characterized in that a structure is obtained, in which a probe forming conductive lower layer is formed on a formed conductive attaching layer for improving attaching strength after forming electrode pads on a wiring substrate, a mask pattern for forming a probe tip forming conductive upper layer is formed at a position corresponding to the probe position is removed by etching in a cylindrical form until the probe forming conductive lower layer is exposed, a probe tip forming conductive upper layer is grown at the position where etching removal has been performed, a mask pattern is removed, a mask pattern which covers a probe tip forming conductive upper layer is formed thereafter at a position corresponding to the probe position, and the probe forming conductive lower layer is removed by etching in a cylindrical form until the conductive attaching layer is exposed, and pin tips are formed as the small probe tip forming conductive upper layer, thus processing into a pin configuration by removing the conductive attaching layer and the mask.

Claims27

Dependent claims

A manufacturing method of a probe head for a semiconductor LSI inspection apparatus which transmits an electric signal to an inspection apparatus body by coming in contact with electrode pads of a semiconductor LSI, the probe head having probes, comprising the steps of:

providing a wiring substrate in which electrode pads for forming probes are arranged on one surface, electrode pads for transmitting an electric signal between the inspection apparatus and the electrode pads of said LSI are arranged on an underside thereof, and the pads on said both sides are interconnected electrically;
forming a conductive attaching layer for improving attaching strength on the electrode pads for forming said probes;
forming a conductive lower layer, having a thickness almost corresponding to a height required for the probes, on said wiring substrate including said conductive attaching layer;
forming a first mask pattern in which openings in the first mask pattern are aligned on a central axis of electrode pads for forming said probes;
forming a probe tip-forming conductive upper layer in said first mask pattern;
removing said first mask pattern on said conductive lower layer;
forming a second mask pattern which covers both said probe tip-forming conductive upper layer and said conductive lower layer, a central axis of the second mask pattern being made to coincide with that of said electrode pads;
forming a pin configuration by applying etching to said conductive lower layer with said second mask pattern as a mask, exposing portions of the conductive attaching layer;
removing the exposed portions of said conductive attaching layer by etching;
and
removing the second mask pattern which covers said probe tip forming conductive upper layer.

8 more elements

providing a wiring substrate in which electrode pads for forming probes are arranged on one surface, electrode pads for transmitting an electric signal between the inspection apparatus and the electrode pads of said LSI are arranged on an underside thereof, and the pads on said both sides are interconnected electrically;
forming a conductive attaching layer for improving attaching strength on the electrode pads for forming said probes;
forming a first mask pattern in which openings in the first mask pattern are aligned on a central axis of electrode pads for forming said probes, said first mask pattern being formed in a thickness almost corresponding to a height required for the probes and being formed on said wiring substrate including said conductive attaching layer for improving attaching strength;
forming a probe-forming conductive lower layer using said first mask pattern as a mask, the conductive lower layer having a height almost corresponding to a height required for the probes;
forming a second mask pattern for forming a probe tip-forming conductive upper layer, which is smaller than said probe-forming conductive lower layer, on said probe-forming conductive lower layer, the second mask pattern having openings exposing the conductive lower layer;
forming a probe tip-forming conductive upper layer on said probe-forming conductive lower layer with said second mask pattern as a mask;
removing said first and second mask patterns;
and
removing said conductive attaching layer by etching.

6 more elements

Dependencies are inferred from the claim text.

Manufacturing method of a probe head for semiconductor LSI inspection apparatus

Life of this patent

Manufacturing method of a probe head for semiconductor LSI inspection apparatus

Life of this patent

Abstract

Claims27