Circuit pattern, semi-finished base material for circuit substrate, metal-based circuit substrate, production method for circuit pattern, and production device for circuit pattern
AssigneeNHK Spring Co., Ltd.
InventorsShinya Yano, Misao Uetake
Life of this patent
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Abstract
A circuit pattern is obtained, capable of being easily applicable to current increase, making short circuit or ion migration between adjacent circuit conductors hard to be generated, and allowing a circuit pattern to be tightly arranged. A circuit pattern comprises a circuit conductor to be layered on a metal substrate through an insulating layer, an intermediate portion in a layer direction having a swelled shape in a layer-crossing direction in a cross section of the circuit conductor, and the swelled shape is formed by a gentle face in the layer direction.
Claims14
A circuit pattern comprising a circuit conductor to be layered on a metal substrate through an insulating layer, comprising:
- an intermediate portion in a layer direction having a swelled shape in a layer-crossing direction in a cross section of the circuit conductor, wherein
- the swelled shape is formed by a gentle etched face in the layer direction, and the circuit pattern has a thickness more than 0.8 mm.
A metal-based circuit substrate in which a circuit pattern comprising a circuit conductor is layered on an obverse face of an insulating layer layered on a metal substrate, comprising:
- an intermediate portion in a layer direction having a swelled shape in a layer-crossing direction relative to at least a portion located on an obverse face of the insulating layer in a cross section of the circuit conductor wherein
- the swelled shape is formed by a gentle etched face in the layer direction, and the circuit pattern has a thickness more than 0.8 mm.
A production method for a circuit pattern, comprising:
- a pattern formation step performing double-side etching to a material plate to form a semi-finished circuit pattern in which portions corresponding to individual circuit conductors composing a circuit pattern are connected through relatively thin connection portions;
- and
- a circuit formation step performing single-side etching to the connection portions from one side face of the semi-finished circuit pattern to form a circuit pattern in which intermediate portions of the circuit conductors in a cross section in a layer direction are formed into a swelled shape and the swelled shape is formed with a gentle face in the layer direction.
A production device for a circuit pattern, comprising:
- a pattern formation device performing double-side etching to a material plate to form a semi-finished circuit pattern in which portions corresponding to individual circuit conductors composing a circuit pattern are connected through relatively thin connection portions;
- and
- a circuit formation device performing single-side etching to the connection portions from one side face of the semi-finished circuit pattern to form the circuit pattern in which intermediate portions of the circuit conductors in a cross section in a layer direction are formed into a swelled shape and the swelled shape is formed with a gentle face in the layer direction.
Dependencies are inferred from the claim text.