H05K 2203/0361
Stripping a part of an upper metal layer to expose a lower
Official title: Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
H05K2203/0361 (Stripping a part of an upper metal layer to expose a lower) appears on 229 US grants and 189 published applications in this corpus.
Search patents in H05K- Granted patents
- 229
- Published applications
- 189
- Assignees
- 136
- Inventors
- 520
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 7 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 4 |
| 2002 | 7 | 11 |
| 2003 | 6 | 16 |
| 2004 | 8 | 13 |
| 2005 | 9 | 8 |
| 2006 | 3 | 10 |
| 2007 | 10 | 17 |
| 2008 | 4 | 10 |
| 2009 | 8 | 14 |
| 2010 | 8 | 27 |
| 2011 | 5 | 9 |
| 2012 | 16 | 9 |
| 2013 | 11 | 8 |
| 2014 | 15 | 4 |
| 2015 | 8 | 7 |
| 2016 | 5 | 5 |
| 2017 | 4 | 3 |
| 2018 | 5 | 2 |
| 2019 | 1 | 2 |
| 2020 | 3 | 2 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 2 | 2 |
| 2024 | 0 | 2 |
| 2025 | 0 | 1 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic component and manufacturing method of electronic component incorporated substrate19 May 2026US 12,635,075 B2Taiyo Yuden Co., Ltd.
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Methods for manufacturing ultrasound transducers and other components19 Dec 2023US 11,845,108 B2Fujifilm Sonosite, Inc.
- Printed wiring board and method for manufacturing printed wiring board28 Nov 2023US 11,832,397 B2Ibiden Co., Ltd.
- Method of manufacturing circuit board16 Aug 2022US 11,419,222 B2Unimicron Technology Corp.
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Apparatus for Treating a Surface of a Printed Circuit Board, Printed Circuit Board with Multi-Profiled Portion, and Method14 May 2026US 2026/0136469 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for manufacturing multilayer substrate27 Nov 2025US 2025/0365869 A1Fict Limited
- Electronic component and manufacturing method of electronic component incorporated substrate3 Oct 2024US 2024/0334599 A1Taiyo Yuden Co., Ltd.
- Wiring substrate12 Sep 2024US 2024/0306296 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996
- Etching of metallic composite articles159US 6,468,439 B1BMC Industries, Inc. · 2002
- Circuit manufacturing using etched tri-metal media125US 6,365,057 B1BMC Industries, Inc. · 2002
- Lamination of circuit sub-elements while assuring registration120US 6,409,930 B1BMC Industries, Inc. · 2002