Electronic component and manufacturing method of electronic component incorporated substrate

An electronic component comprising:

• a base body;
• a first internal element that is provided inside the base body;
• a first external electrode that is provided on the base body and electrically connected to the first internal element;
• and a second external electrode that is provided on the base body so as to be separated from the first external electrode and electrically connected to the first internal element, wherein the first external electrode has a first outer metal layer, and a first inner metal layer that is provided between the first outer metal layer and the first internal element, the second external electrode has a second outer metal layer, and a second inner metal layer that is provided between the second outer metal layer and the first internal element, and the first inner metal layer has a lower laser absorption rate than any of the first outer metal layer and the second outer metal layer, and the second inner metal layer has a lower laser absorption rate than any of the first outer metal layer and the second outer metal layer;
• and a second internal element that is provided inside the base body while being separated from the first internal element;
• a third external electrode that is provided on the base body so as to be separated from the first external electrode and the second external electrode and electrically connected to the second internal element;
• and a fourth external electrode that is provided on the base body so as to be separated from the first external electrode, the second external electrode, and the third external electrode and electrically connected to the second internal element, wherein the third external electrode has a third outer metal layer, and a third inner metal layer that is provided between the third outer metal layer and the second internal element, the fourth external electrode has a fourth outer metal layer, and a fourth inner metal layer that is provided between the fourth outer metal layer and the second internal element, the first inner metal layer has a lower laser absorption rate than any of the first outer metal layer, the second outer metal layer, the third outer metal layer, and the fourth outer metal layer, the second inner metal layer has a lower laser absorption rate than any of the first outer metal layer, the second outer metal layer, the third outer metal layer, and the fourth outer metal layer, the third inner metal layer has a lower laser absorption rate than any of the first outer metal layer, the second outer metal layer, the third outer metal layer, and the fourth outer metal layer, and the fourth inner metal layer has a lower laser absorption rate than any of the first outer metal layer, the second outer metal layer, the third outer metal layer, and the fourth outer metal layer.