Method of manufacturing circuit board

A method of manufacturing a circuit board, comprising:

• providing a substrate, the substrate comprising a bottom layer and a resin layer over the bottom layer, the resin layer comprising a first surface and a second surface opposite to the first surface, the first surface in contact with the bottom layer;
• forming a plurality of vias through the resin layer;
• depositing a first metal layer in the vias, the first metal layer in contact with the bottom layer and filling a portion of each of the vias;
• depositing a second metal layer over the first metal layer, the second metal layer disposed in the vias;
• forming a patterned metal layer over the second metal layer, wherein the patterned metal layer extends from each of the vias to a position over the second surface;
• separating the bottom layer and the resin layer;
• and
• removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.