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US 12,716,133 B2Granted
Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards
AssigneeAtotech Deutschland GmbH
InventorBernhard Schachtner
Life of this patent
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Abstract
A process for treating a tin or tin alloy layer onto metal surfaces, preferred copper surfaces, comprising the steps of (i) providing a metal surface, preferred a copper surface, (ii) contacting the metal surface, preferred the copper surface, with a tin or tin alloy plating bath; and (iii) oxidizing the tin or tin alloy layer obtained by step (ii).
Claims17
A process for treating a tin or tin alloy layer onto metal surfaces, comprising the steps of
- (i) providing a metal surface, wherein the metal surface is a circuit carrier metal surface,
- (ii) contacting the metal surface, with a tin or tin alloy plating bath;
- and
- (iii) oxidizing the tin or tin alloy layer obtained by step (ii),
- wherein step (iii) is performed by contacting the tin or tin alloy layer obtained by step (ii) with a composition comprising at least one solvent and at least one oxidizing agent, and
- wherein the composition does not comprise ionic species.
3 more elements
Dependencies are inferred from the claim text.