H05K 2203/0346
Deburring, rounding, bevelling or smoothing conductor edges
H05K2203/0346 (Deburring, rounding, bevelling or smoothing conductor edges) appears on 69 US grants and 54 published applications in this corpus.
Search patents in H05K- Granted patents
- 69
- Published applications
- 54
- Assignees
- 57
- Inventors
- 169
- Latest grant
- 18 Jul 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 12 |
| 2002 | 11 | 1 |
| 2003 | 4 | 0 |
| 2004 | 5 | 3 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 1 | 3 |
| 2008 | 1 | 2 |
| 2009 | 1 | 4 |
| 2010 | 2 | 3 |
| 2011 | 2 | 2 |
| 2012 | 0 | 0 |
| 2013 | 4 | 1 |
| 2014 | 2 | 8 |
| 2015 | 4 | 0 |
| 2016 | 1 | 0 |
| 2017 | 1 | 2 |
| 2018 | 1 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 2 |
| 2021 | 0 | 2 |
| 2022 | 3 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 2 |
| 2025 | 0 | 2 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Apparatus and methods for substantial planarization of solder bumps101US 6,267,650 B1Micron Technology, Inc. · 2001
- Method of making plated through hole printed circuit board28US 4,017,968 AJerobee Industries, Inc. · 1977
- Method for the production of through holes in a laminate21US 4,023,998 APerstorp AB · 1977
- IC card21US 4,893,001 AITT Corporation · 1990
- Process for producing a printed wiring board20US 5,638,598 AHitachi Chemical Company, Ltd. · 1997