Systems and methods for manufacturing printed circuit boards
OwnerPrashant Patilinventor
Life of this patent
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Abstract
Systems and methods for overcoming technical problems associated with machining and manufacturing printed circuit boards. In some embodiments, the systems and methods include a process to remove or reduce defects in initially created printed circuit board (PCB) traces. For example, a method can include a process to remove or reduce burrs of laser micromachined PCB traces (which can be electrically isolated from each other). In some cases, a material is deposited over the PCB traces, and the depositing results in a conducting layer that electrically connects all or most of the PCB traces and provides an electrical connection for removing or reducing the defects in the PCB traces.
Claims20
A method of reducing one or more defects from multiple traces of a printed circuit board (PCB), comprising:
- depositing a thin film conducting layer over at least some of the multiple traces formed on the PCB, the multiple traces being electrically isolated from each other, the thin-film conducting layer electrically connecting at least some of the one or more defects on the traces after the thin film conducting layer is deposited;
- and
- applying an electrical current to the thin film conducting layer in a first polarity to reduce or eliminate the one or more defects on the multiple traces.
An electro isle deburring (EID) process to reduce or eliminate one or more defects occurring on one or more traces carried on a substrate of a printed circuit board (PCB), the one or more traces comprising at least some island traces electrically isolated from each other, the EID comprising:
- depositing a conducting layer over the one or more PCB traces, the conducting layer electrically connecting at least some of the one or more PCB traces and at least some of the one or more defects;
- and
- applying an electrical current to the conducting layer to reduce or eliminate the one or more defects in the one or more PCB traces.
A method, comprising:
- applying an electro isle deburring (EID) process to reduce or eliminate burrs occurring on laser micromachined printed circuit board (PCB) traces, at least some of the PCB traces being electrically isolated from each other, the EID process, comprising:
- depositing a conducting layer over the PCB traces, resulting in the conducting layer electrically connects at least some of the PCB traces;
- and
- applying an electrical current or voltage to the conducting layer to reduce or eliminate the burrs.
Dependencies are inferred from the claim text.