Circuit board

Abstract

The present disclosure discloses a circuit board including a substrate layer and a conductive layer attached to one side of the substrate layer, the conductive layer being divided into a copper-plated area and a non-copper-plated area adjacent to the copper-plated area, the conductive layer having a greater thickness in the copper-plated area than in the non-copper-plated area, a boundary pattern being formed at the demarcation between the copper-plated area and the non-copper-plated area. In the direction from the non-copper-plated area toward the copper-plated area, the distance between the border pattern from the middle outward and the edge of the corresponding side of the non-copper-plated area gradually decreases. When the platen roller reaches the boundary pattern position, the air can be squeezed from the middle to both sides along the boundary pattern, thus reducing the air bubbles at the junction of copper-plated and non-copper-plated areas.

Dependencies are inferred from the claim text.