Dual laser repair device and operating method thereof

A dual laser repair device, which is used to carry out repairs on a defective circuit of a circuit board, wherein the defective circuit has two conducting portions, with a defective portion being located between the two conducting portions;

• the dual laser repair device comprising:
• a dual laser repair module, further including:
• a first laser member;
• and
• a second laser member, which is configured adjacent to the first laser member, wherein the first laser member and the second laser member, after configuration thereof, are used to separately emit a laser beam with different energies and/or with different angles of divergence directed toward the circuit board, the first laser member is used to transform the defective portion of the circuit into a sintered portion, whereafter the second laser member is used to carry out deflashing of the sintered portion, causing sintered sides of the sintered portion to be flush with two conducting sides of the two conducting portions, wherein, the first laser member is parallel to the second laser member in a first direction, and the energy of the laser beam emitted by the first laser member is greater than the energy of the laser beam emitted by the second laser member and/or the angle of divergence of the laser beam emitted by the first laser member is greater than the angle of divergence of the laser beam emitted by the second laser member;
• a first displacement module, which is connected to the dual laser repair module, and is used to displace the dual laser repair module in the first direction;
• a second displacement module, which is connected to the first displacement module, and is used to displace the first displacement module in a second direction;
• and
• a third displacement module, which is provided with a loading platform, wherein the loading platform is used to load-support the circuit board, and the third displacement module is used to displace the loading platform in a third direction, wherein each of the first direction, the second direction, and the third direction is perpendicular to the other two directions;
• wherein the dual laser repair module is provided with a detector lens, which is positioned at a side of the second laser member away from the first laser member, and the second laser member is positioned between the first laser member and the detector lens in the second direction;
• wherein the detector lens is orientated toward the circuit board, and is used to detect a current position of the circuit board, and produces a drive signal according to the current position, wherein the drive signal is used to drive movement of the first displacement module, the second displacement module, and the third displacement module, thereby enabling positioning the dual laser repair module and the circuit board at a specific position.