Carrier substrate for electrical, more particularly electronic, components, and method for producing a carrier substrate

A carrier substrate (1) comprising

• an insulation layer (11) and a metal layer (12), wherein the metal layer (12) and the insulation layer (11) are materially bonded to each other by a DCB bonding process,
• wherein a flank profile (2) at least zonally borders the metal layer (12) in a primary direction (P) extending parallel to the main extension plane (HSE),
• wherein, viewed in the primary direction (P), the flank profile (2) extends from a first edge (15) on an upper side (31) of the metal layer (12), which faces away from the insulation layer (11), to a second edge (16) on a lower side (32) of the metal layer (12), which faces the insulation layer (11), characterized in that the flank profile (2), viewed in the primary direction (P), has at least one local maximum (21) and at least one local minimum (22).