Component carrier with an etching neck connecting back drill hole with vertical through connection
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsMarkus Kastelic, Lackner Sebastian
Life of this patent
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Abstract
A component carrier includes a stack with a plurality of electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures include an electrically conductive vertical through-connection and a horizontally extending electrically conductive trace electrically coupled with an end portion of the vertical through-connection. A back-drill hole extends through at least part of the at least one electrically insulating layer structure towards the end portion of the vertical through-connection. An etching neck connects the back-drill hole with the end portion of the vertical through-connection.
Claims14
A component carrier, comprising:
- a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure;
- wherein the electrically conductive layer structures comprise an electrically conductive vertical through-connection and a horizontally extending electrically conductive trace electrically coupled with an end portion of the vertical through-connection;
- a back-drill hole extending through at least part of the at least one electrically insulating layer structure towards the end portion;
- and
- an etching neck extending from the back-drill hole to the end portion of the vertical through-connection, the etching neck defined by a surface of the at least one electrically insulating layer structure,
- wherein the vertical through-connection comprises an electrically conductive stub between the etching neck and the electrically conductive trace, and
- wherein a length of the electrically conductive stub is larger than a length of the etching neck.
A method of manufacturing a component carrier, comprising:
- providing a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure;
- forming the electrically conductive layer structures with an electrically conductive vertical through-connection and a horizontally extending electrically conductive trace electrically coupled with the vertical through-connection;
- drilling a back-drill hole through at least part of the at least one electrically insulating layer structure and into the vertical through-connection;
- and
- etching an etching neck between the back-drill hole and an end portion of the vertical through-connection, the etching neck defined by a surface of the at least one electrically insulating layer structure,
- wherein the vertical through-connection comprises an electrically conductive stub between the etching neck and the electrically conductive trace, and
- wherein a length of the electrically conductive stub is larger than a length of the etching neck.
A component carrier, comprising:
- a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure;
- wherein the electrically conductive layer structures comprise an electrically conductive vertical through-connection and a horizontally extending electrically conductive trace electrically coupled with an end portion of the vertical through-connection;
- a back-drill hole extending through at least part of the at least one electrically insulating layer structure towards the end portion;
- an etching neck extending from the back-drill hole to the end portion of the vertical through-connection, the etching neck defined by a surface of the at least one electrically insulating layer structure, wherein a diameter of the etching neck is smaller than a diameter of the back-drill hole;
- and a test structure which comprises at least one horizontally extending electrically conductive trace at a vertical level of and connected to the etching neck.
Dependencies are inferred from the claim text.