H05K 2203/0392
Pretreatment of metal
Official title: Pretreatment of metal, e.g. before finish plating, etching
H05K2203/0392 (Pretreatment of metal) appears on 97 US grants and 82 published applications in this corpus.
Search patents in H05K- Granted patents
- 97
- Published applications
- 82
- Assignees
- 70
- Inventors
- 265
- Latest grant
- 8 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 3 | 1 |
| 2004 | 0 | 6 |
| 2005 | 0 | 1 |
| 2006 | 0 | 3 |
| 2007 | 2 | 7 |
| 2008 | 1 | 3 |
| 2009 | 4 | 5 |
| 2010 | 3 | 4 |
| 2011 | 5 | 2 |
| 2012 | 1 | 2 |
| 2013 | 2 | 0 |
| 2014 | 2 | 3 |
| 2015 | 1 | 5 |
| 2016 | 3 | 8 |
| 2017 | 2 | 5 |
| 2018 | 3 | 7 |
| 2019 | 7 | 2 |
| 2020 | 3 | 2 |
| 2021 | 3 | 4 |
| 2022 | 3 | 4 |
| 2023 | 2 | 0 |
| 2024 | 2 | 3 |
| 2025 | 3 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Hydrophobic low-dielectric-constant film and preparation method therefor8 Jul 2025US 12,351,911 B2Jiangsu Favored Nanotechnology Co., Ltd.
- Methods for producing an etch resist pattern on a metallic surface8 Apr 2025US 12,270,111 B2Kateeva, Inc.
- Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil25 Feb 2025US 12,233,621 B2Panasonic Intellectual Property Management Co., Ltd.
- Catalyzed metal foil and uses thereof to produce electrical circuits13 Aug 2024US 12,063,748 B2Averatek Corporation
- Stacked-layer board, electronic component module, and method of manufacturing stacked-layer board30 Jul 2024US 12,052,821 B2Murata Manufacturing Co., Ltd.
- Method for producing conductive base material, method for producing electronic device, method for producing electromagnetic shield film, method for producing sheet-like heating element, and conductive base material26 Feb 2026US 2026/0055513 A1Sato Holdings Kabushiki Kaisha
- Component carrier, method for manufacturing a component carrier and a package comprising a component carrier2 Oct 2025US 2025/0309013 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component Carrier, Component Carrier Arrangement and Method of Manufacturing the Component Carrier25 Sep 2025US 2025/0300060 A1AT&S (Chongqing) Company Limited
- Methods for producing an etch resist pattern on a metallic surface19 Jun 2025US 2025/0198008 A1Kateeva, Inc.
- Surface-treated copper foil for high-frequency circuit and method for producing the same22 May 2025US 2025/0168969 A1Circuit Foil Luxembourg
Most cited
By later US patents
- Solder resist composition and printed circuit boards97US 6,217,987 B1Ibiden Co., Ltd. · 2001
- Selective electroless plating process for metal conductors94US 5,167,992 AMicroelectronics and Computer Technology Corporation · 1992
- Thin-film assembly and method for producing said assembly68US 7,551,454 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · 2009
- Circuit board material and electroplating bath for the production thereof64US 4,892,776 AOhmega Electronics, Inc. · 1990
- Chemical plating process56US 4,002,778 AE. I. Du Pont de Nemours and Company · 1977