Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil

A copper foil with resin comprising:

• a resin layer containing a resin composition or a semi-cured product of the resin composition;
• and
• a surface treated copper foil on one surface of the resin layer, wherein
• the resin composition contains a polymer having a structural unit represented by the following Formula (1) in a molecule:
• wherein in Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms,
• the resin composition further contains a modified polyphenylene ether compound having a terminal modified with the following Formula (5) or (6):
• wherein in Formula (5), s represents an integer 0 to 10, Z represents an arylene group, and R12 to R14 each independently represent a hydrogen atom or an alkyl group,
• wherein in Formula (6), R15 represents a hydrogen atom or an alkyl group;
• and
• the surface treated copper foil includes a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, wherein
• the finely roughened particle treatment layer is formed of fine copper particles having a particle size of 40 to 200 nm,
• a heat resistance treatment layer containing nickel is provided on the finely roughened particle treatment layer,
• a rust prevention treatment layer containing at least chromium is provided on the heat resistance treatment layer,
• a silane coupling agent layer is provided on the rust prevention treatment layer, and
• an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.

A resin composition for formation of an insulating layer in a copper clad laminate including the insulating layer containing a cured product of the resin composition and a surface treated copper foil on one surface or both surfaces of the insulating layer,

• the resin composition comprising a polymer having a structural unit represented by the following Formula (1) in a molecule:
• wherein in Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms,
• the resin composition further comprising a modified polyphenylene ether compound having a terminal modified with the following Formula (5) or (6);
• wherein in Formula (5), s represents an integer 0 to 10, Z represents an arylene group, and R12 to R14 each independently represent a hydrogen atom or an alkyl group,
• wherein in Formula (6), R15 represents a hydrogen atom or an alkyl group;
• and
• the surface treated copper foil includes a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, wherein
• the finely roughened particle treatment layer is formed of fine copper particles having a particle size of 40 to 200 nm,
• a heat resistance treatment layer containing nickel is provided on the finely roughened particle treatment layer,
• a rust prevention treatment layer containing at least chromium is provided on the heat resistance treatment layer,
• a silane coupling agent layer is provided on the rust prevention treatment layer, and
• an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.