Solder resist composition and printed circuit boards

A printed circuit board comprising a wiring substrate provided with conductor circuits and a solder resist layer formed on a surface of the wiring substrate and the conductor circuits, in which the solder resist layer is formed by curing a solder resist composition comprising an acrylate of novolac epoxy resin and an imidazole curing agent and having a viscosity of 0.5-10 Pa·s at 25° C. adjusted by using a glycol ether solvent comprising at least one of diethylene glycol dimethyl ether and triethylene glycol dimethyl ether.

A printed circuit board comprising a wiring substrate provided with conductor circuits, at least one insulating layer which is on and covers at least a portion of the wiring substrate and the conductor circuits, wherein the conductor circuits contact the wiring substrate and at least one insulating layer, a solder resist layer formed on the at least one insulating layer, wherein a roughened layer is formed on a surface of at least one of the conductor circuits, wherein a portion of the roughened layer is exposed from an opening formed in the solder resist layer, wherein the roughened layer comprises a copper-nickel-phosphorus alloy layer.

A printed circuit board comprising a wiring substrate provided with conductor circuits, at least one insulating layer which is on and covers at least a portion of the wiring substrate and the conductor circuits, wherein the conductor circuits contact the wiring substrate and at least one insulating layer, a solder resist layer formed after the conductor circuits and on the at least one insulating layer, the solder resist layer and the at least one insulating layer having an opening portion, a pad on the conductor circuits which pad is exposed at the opening portion in the solder resist layer and the at least one insulating layer, and a solder body on the pad, wherein the solder resist layer is made from a composition comprising an acrylate of novolac epoxy resin and an imidazole curing agent, wherein the pad contacts the conductor circuits through the opening in the insulating resin layer.

A printed circuit board comprising a wiring substrate provided with conductor circuits, at least one insulating layer which is on and covers at least a portion of the wiring substrate and the conductor circuits, wherein the conductor circuits contact the wiring substrate and at least one insulating layer, a solder resist layer formed after the conductor circuits and on a surface of the at least one insulating layer, the solder resist layer and the at least one insulating layer having an opening portion, a pad on the conductor circuits which pad is exposed at the opening portion in the solder resist layer and the at least one insulating layer, and a solder body on the pad, wherein a surface of the pad exposed at the opening portion is rendered into an electrically conductive roughened layer, and a metal layer including a non-oxidizing metal on at least a surface of the metal layer, the metal layer being on the surface of the pad exposed at the opening portion, and the solder is supported on the pad through the metal layer.

A printed circuit board comprising a wiring substrate provided with conductor circuits, at least one insulating layer which is on and covers at least a portion of the wiring substrate and the conductor circuits, wherein the conductor circuits contact the wiring substrate and at least one insulating layer, a solder resist layer formed after the conductor circuits and on a surface of the at least one insulating layer, the solder resist layer and the at least one insulating layer having an opening portion, a pad on the conductor circuits which pad is exposed at the opening portion in the solder resist layer and the at least one insulating layer, and a solder body on the pad, wherein a surface of at least one of the conductor circuits exposed at the opening portion is rendered into an electrically conductive roughened layer, and a metal layer including a non-oxidizing metal on at least a surface of the metal layer, the metal layer being on the surface of the pad exposed at the opening portion, and the solder is supported on the pad through the metal layer.

A printed circuit board comprising an insulating layer, a conductor circuit formed thereon, the conductor circuit comprising an electrolytic film on an electroless plated film, a roughened layer formed on at least a part of a surface of the electrolytic film and a solder resist layer covering at least a portion of the conductor circuit, the solder resist layer having an opening portion, the conductor circuit contacting a solder pad comprising a gold layer on a nickel layer, the solder pad being in the opening portion of the solder resist layer.

A printed circuit board comprising an insulating layer, a solder pad formed thereon, the solder pad comprising a gold layer on a nickel layer on an electrolytic film on an electroless plated film, a roughened layer formed on at least a part of a surface of the electrolytic film and a solder body formed on the solder pad.