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US 12,052,821 B2Granted
Stacked-layer board, electronic component module, and method of manufacturing stacked-layer board
AssigneeMurata Manufacturing Co., Ltd.
InventorTakuya Goitsuka
Life of this patent
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Abstract
A stacked-layer board includes a base material including a plurality of dielectric layers stacked on each other, a first main surface being a surface at one end in a stacking direction of the plurality of dielectric layers, and a second main surface being a surface at the other end in the stacking direction, and a first conductor provided on the first main surface, and a first groove is in a surface of the first conductor.
Claims16
A stacked-layer board comprising:
- a base material including:
- a plurality of dielectric layers stacked on each other;
- a first main surface being a surface at one end in a stacking direction of the plurality of dielectric layers;
- and a second main surface being a surface at another end in the stacking direction;
- a first conductor provided on the first main surface, wherein a first groove is in a surface of the first conductor;
- and a first base material groove provided in the first main surface;
- and a first land portion provided on the surface of the first conductor, wherein the first base material groove and the first conductor are formed at different positions on the first main surface, and wherein the first land portion extends beyond the surface of the first conductor only in a direction parallel to an extension direction of the first base material groove.
4 more elements
Dependencies are inferred from the claim text.