Thin-film assembly and method for producing said assembly

A thin-film assembly comprising a substrate, said substrate being comprised of a printed circuit board including an insulation-material base body and a metal lamination as a conductor layer, wherein the insulation-material base body comprises an insulation material selected from the group consisting of epoxy resin, polyimide, polyethylene naphtalate, polyester or polyether etherketone, and including at least one electronic component applied on the substrate, wherein a base electrode formed by the conductor layer is provided on the substrate, on which base electrode layers belonging to the component and including an upper cover-electrode are arranged, wherein the component is applied by thin-film technology, and the conductor layer is smoothed at least on the location of the thin-film component, wherein the smoothed conducter layer over surface areas having the dimensions of 20×20 μm2 (micro-roughness), exhibits a maximum mean surface roughness of 10 nm and a contact layer is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer and the superimposed thin-film layers of the thin-film component, which contact layer is physically or chemically adsorbed directly on the surface of the base electrode, wherein the contact layer is arranged to passivate the conductor layer, and the contact layer further constitutes an electric contacting-promoting layer and an adhesion-improving layer for enhancing the electric contact between the conductor layer and the thin film component and for stabilizing the adherence of the thin film component on the conductor layer, respectively.