Circuit board material and electroplating bath for the production thereof

A printed circuit board material in the form of a multilayer stock comprising:

• a support layer;
• at least one electrical resistance layer adhering to the support layer;
• and
• a conductive layer adhering to the resistance layer, the conductive layer having an activating agent applied thereto before the resistance layer is deposited onto the conductive layer, the electrical resistance layer comprising a nickel-phosphorous composition electro-deposited in a bath having at least 0.25M nickel hypophosphite, wherein the electrical resistance layer and the conductive layer are both removable by a single copper etchant.

A circuit board material comprising:

• a support layer;
• at least one electrical resistance layer adhered to the support layer, the resistance layer having a nickel phosphorous composition, the composition including from about 10 to about 50 percent by weight of phosphorous;
• and
• a conductive layer adhered to the resistance material layer, the conductive layer having benzotriazole applied thereto before the resistance layer is deposited onto the conductive layer,
• wherein the resistance layer of the circuit board material has an electrical resistance of at least 500 ohms per square.

A printed circuit board material in the form of a multilayer stock comprising:

• a support layer;
• at least one electrical resistance layer adhering to the support layer, the electrical resistance layer comprising a nickel phosphorous composition, including from about 10 to about 50 percent phosphorous;
• and
• a conductive layer adhering to the resistance layer, the conductive layer having an activating agent applied thereto before the resistance layer is deposited onto the conductive layer,
• wherein the nickel phosphorous composition is electro-deposited on the conductive layer in a bath having at least 0.25M nickel hypophosphite.