Component Carrier, Component Carrier Arrangement and Method of Manufacturing the Component Carrier

A component carrier arrangement, comprising:

• a component carrier with a stack, comprising:
• at least one electrically insulating layer structure and at least one electrically conductive layer structure on top of the electrically insulating layer structure;
• and
• at least one lateral wall;
• wherein the at least one electrically insulating layer structure comprises a first edge portion defining at least partially the lateral wall of the stack;
• and
• wherein the at least one electrically conductive layer structure comprises a second edge portion being offset with respect to the first edge portion towards the inner part of the stack by a distance in the range between 0.05 μm and 15 μm;
• and
• a further component carrier;
• wherein the at least one electrically conductive layer structure and a further electronic conductive layer structure, provided on the further component carrier, are electrically connected.

A method of manufacturing a component carrier, the method comprising:

• providing a stack that comprises at least one electrically insulating layer structure;
• forming an electrically conductive layer structure on top of the electrically insulating layer structure, such that a first edge portion of the at least one electrically insulating layer structure and a second edge portion of the electrically conductive layer structure define at least partially the lateral wall of the stack;
• and
• removing a part of the second edge portion of the electrically conductive layer structure, so that the second edge portion is offset with respect to the first edge portion towards the inner part of the stack by a distance in the range between 0.05 μm and 15 μm.