H05K 2203/0323
Working metal substrate or core
Official title: Working metal substrate or core, e.g. by etching, deforming
H05K2203/0323 (Working metal substrate or core) appears on 140 US grants and 134 published applications in this corpus.
Search patents in H05K- Granted patents
- 140
- Published applications
- 134
- Assignees
- 89
- Inventors
- 319
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 2 |
| 2003 | 1 | 3 |
| 2004 | 1 | 1 |
| 2005 | 2 | 6 |
| 2006 | 4 | 8 |
| 2007 | 6 | 8 |
| 2008 | 4 | 7 |
| 2009 | 3 | 6 |
| 2010 | 8 | 7 |
| 2011 | 7 | 7 |
| 2012 | 7 | 9 |
| 2013 | 8 | 5 |
| 2014 | 7 | 17 |
| 2015 | 7 | 2 |
| 2016 | 7 | 5 |
| 2017 | 5 | 3 |
| 2018 | 1 | 3 |
| 2019 | 4 | 5 |
| 2020 | 3 | 2 |
| 2021 | 0 | 2 |
| 2022 | 1 | 6 |
| 2023 | 2 | 6 |
| 2024 | 5 | 11 |
| 2025 | 1 | 2 |
| 2026 | 7 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and method for manufacturing the same21 Jul 2026US 12,690,140 B2Samsung Electro-Mechanics Co., Ltd.
- Methods for promoting selective copper foil adhesion in a printed circuit board7 Jul 2026US 12,677,377 B2Rockwell Collins, Inc.
- Method of manufacturing printed circuit board2 Jun 2026US 12,648,086 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring circuit board and method for producing wiring circuit board26 May 2026US 12,641,717 B2Nitto Denko Corporation
- Apparatus and method for manufacturing power module7 Apr 2026US 12,598,704 B2Hyundai Mobis Co., Ltd.
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Methods for promoting selective copper foil adhesion in a printed circuit board8 May 2025US 2025/0151205 A1Rockwell Collins, Inc.
- Method for manufacturing circuit board20 Feb 2025US 2025/0063671 A1Lx Semicon Co., Ltd.
- Method of manufacturing printed circuit board12 Dec 2024US 2024/0414849 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board structure and manufacturing method thereof12 Dec 2024US 2024/0414850 A1Unimicron Technology Corp.
Most cited
By later US patents
- Substrate for electronic packaging, pin jig fixture105US 6,448,510 B1Micro Components Ltd. · 2002
- Integrated circuit packaging using flexible substrate87US 5,065,227 AInternational Business Machines Corporation · 1991
- Multi-layer ground plane structures for integrated lead suspensions79US 7,929,252 B1Hutchinson Technology Incorporated · 2011
- Multilayer board having insulating isolation rings68US 5,872,338 AProlinx Labs Corporation · 1999
- Printed circuit board61US 4,221,925 AWestern Electric Company, Inc. · 1980