Multilayer board having insulating isolation rings

An integrated circuit package comprising as multilayered structure comprising:

• a support layer having a first side and a second side opposite said first side, said support layer comprising an island formed of a conductive material, an isolation ring formed of a dielectric material and surrounding said island, and a portion formed of said conductive material and surrounding said isolation ring;
• a first compound layer formed on said first side of said support layer, said first compound layer having a first dielectric layer, a first via hole formed in said first dielectric layer at a first location adjacent said island, and a first conductive element located in said first via hole in electrical contact with said island;
• a first conductive layer formed on said first compound layer, said first conductive layer comprising a plurality of first contacts, a predetermined one of said first contacts being formed in electrical contact with said first conductive element;
• a second compound layer formed on said second side of said support layer, said second compound layer having a second dielectric layer, a second via hole formed in said second dielectric layer at a second location adjacent said conductive island, and a second conductive element located in said second via hole in electrical contact with said island;
• a second conductive layer formed on said second compound layer, said second conductive layer comprising a plurality of second contacts, a predetermined one of said second contacts being formed in electrical contact with said second conductive element such that said predetermined one of said second contacts is electrically coupled to said predetermined one of said first contacts through at least said second conductive element, said island and said first conductive element;
• wherein said support layer has a first thickness greater than a thickness of any layer selected from a group consisting of said first compound layer, said first conductive layer, said second compound layer and said second conductive layer, to thereby provide structural support for each of said layers in said group;
• a plurality of substrate balls, each of said substrate balls being formed in electrical contact with one of said second contacts, a a first one of said substrate balls being formed in electrical contact with said predetermined one of said second contacts;
• a plurality of die connectors, each of said die connectors being coupled to one of said first contacts such that a predetermined one of said die connectors is electrically coupled by said predetermined one of said first contacts.

A structure for supporting one or more electronic components, said structure comprising:

• a support layer having a first side and a second side opposite said first side, said support layer comprising:
• an island formed of a conductive material,
• an isolation ring formed of a dielectric material and surrounding said island, and
• a portion formed of said conductive material and surrounding said isolation ring;
• a first compound layer formed on said first side of said support layer, said first compound layer having:
• a first dielectric layer,
• a first via hole formed in said first dielectric layer at a first location adjacent said island, and
• a first conductive element located in said first via hole in electrical contact with said island;
• a first conductive layer formed on said first compound layer, said first conductive layer comprising a plurality of first contacts, a predetermined one of said first contacts being formed in electrical contact with said first conductive element;
• wherein each of said first contacts is predetermined for attachment to a substrate ball and said island is predetermined for attachment to a die connector supported by said second side of said support layer.