Method of manufacturing printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Ju Gi, Young Il Cho
Life of this patent
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Abstract
A method of manufacturing a printed circuit board includes forming an intermediate layer on a first conductive layer disposed on a first insulating layer, forming a second conductive layer and a second insulating layer on the intermediate layer, separating the first insulating layer from at least one portion of the first conductive layer, and etching the first conductive layer and the intermediate layer. After the etching, a surface of the second conductive layer protrudes further than a surface of the second insulating layer. The intermediate layer before the etching includes a portion overlapping the second conductive layer in a vertical direction and another portion not overlapping the second conductive layer in the vertical direction.
Claims17
A method of manufacturing a printed circuit board, the method comprising:
- forming an intermediate layer on a first conductive layer disposed on a first insulating layer;
- forming a second conductive layer and a second insulating layer on the intermediate layer to form a stacked structure;
- separating the first insulating layer from at least one portion of the first conductive layer;
- and
- etching the first conductive layer and the intermediate layer,
- wherein before the separating, the second conductive layer entirely protrudes from the intermediate layer in a cross-section of the stacked structure,
- wherein after the etching, a surface of the second conductive layer protrudes further than a surface of the second insulating layer, and
- wherein the intermediate layer before the etching includes one portion overlapping the second conductive layer in a vertical direction and the other portion not overlapping the second conductive layer in the vertical direction.
Dependencies are inferred from the claim text.