Circuit board structure and manufacturing method thereof

A manufacturing method of a circuit board structure, comprising:

• providing a core layer, the core layer has a first surface and a second surface opposite to each other and comprises at least one dielectric portion and at least one metal portion;
• electroplating at least one electroplating metal layer on at least one of the first surface and the second surface of the core layer, the at least one electroplating metal layer exposes a portion of at least one of the first surface and the second surface and is at least connected to the at least one metal portion;
• laminating at least one dielectric layer on at least one of the first surface and the second surface of the core layer and on the at least one electroplating metal layer;
• performing a drilling process on the at least one dielectric layer to form at least one opening that exposes a portion of the at least one electroplating metal layer;
• and
• forming at least one conductive metal layer in the at least one opening of the at least one dielectric layer, and the at least one conductive metal layer is correspondingly connected to the at least one electroplating metal layer.