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US 12,690,140 B2Granted
Circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorMyungju Gi
Life of this patent
Estimating the term…
Abstract
Disclosed is a circuit board including: an insulation layer for burying at least one wire layer and at least one via layer and having a first side and a second side facing each other, and a first wire layer partly protruding over the first side of the insulation layer and partly buried in the insulation layer, wherein the insulation layer has a concave cavity dented from the first side, and part of the via layer is exposed from the insulation layer through a bottom side of the cavity.
Claims8
A circuit board comprising:
- an insulation layer, in which at least one wire layer and a via layer are disposed, the insulating layer having a first side and a second side opposing each other;
- and
- a first wire layer partly protruding over the first side of the insulation layer and partly disposed in the insulation layer,
- wherein the insulation layer has a concave cavity dented in a thickness direction of the circuit board from the first side,
- the via layer includes one via having a part exposed from the insulation layer through a bottom side of the cavity and another via connected to the first wire layer, and
- a thickness of the one via in the thickness direction is less than a thickness of the another via in the thickness direction.
3 more elements
Dependencies are inferred from the claim text.