Wiring circuit board and method for producing wiring circuit board

A method for producing a wiring circuit board comprising:

• a step (1) of producing a substrate with a metal support board including a metal support board and a step (2) of etching the metal support board in order, wherein
• the wiring circuit board includes a frame, a mounting portion spaced from the frame and surrounded by the frame, an opening portion disposed between the frame and the mounting portion, and a joint connecting the frame to the mounting portion and traversing the opening portion;
• each of the frame and the mounting portion includes a metal support layer, a base insulating layer, a conductive layer, and a cover insulating layer in order toward one side in a thickness direction;
• the joint does not include the metal support layer, and includes the base insulating layer, the conductive layer, and the cover insulating layer in order toward one side in the thickness direction;
• the substrate with a metal support board includes the metal support board including the metal support layer, the base insulating layer, the conductive layer, and the cover insulating layer;
• and
• in the step (2), by etching the metal support board corresponding to the opening portion and the joint from the other side in the thickness direction by using an etching resist, the metal support layer is formed.