Apparatus and method for manufacturing power module

A method for manufacturing a power module, the method comprising:

• forming a metal pattern on a circuit board;
• coupling a terminal to the circuit board and electrically connecting the terminal to at least a portion of the metal pattern;
• bonding a power device chip to the circuit board and electrically connecting the power device to at least a portion of the metal pattern and the terminal;
• covering the power device chip and the circuit board with a molding part;
• disposing a pattern layer on at least one of an upper surface and a lower surface of a base part of the circuit board to provide the metal pattern, the base part comprising an insulating material;
• and
• positioning a thin film resistor having a predetermined circuit pattern such that the predetermined circuit pattern connects to the metal pattern disposed on the base part,
• wherein the forming of the thin film resistor comprises:
• preparing a mask having an opening corresponding to the circuit pattern;
• and
• disposing the mask on the circuit board, on the pattern layer, and sputtering a resistor material on the circuit board through the opening.