H05K 2203/0315
Oxidising metal
H05K2203/0315 (Oxidising metal) appears on 484 US grants and 397 published applications in this corpus.
Search patents in H05K- Granted patents
- 484
- Published applications
- 397
- Assignees
- 239
- Inventors
- 1,139
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 8 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 15 | 0 |
| 1993 | 11 | 0 |
| 1994 | 9 | 0 |
| 1995 | 13 | 0 |
| 1996 | 12 | 0 |
| 1997 | 13 | 0 |
| 1998 | 18 | 0 |
| 1999 | 13 | 0 |
| 2000 | 4 | 0 |
| 2001 | 14 | 4 |
| 2002 | 16 | 20 |
| 2003 | 19 | 20 |
| 2004 | 16 | 14 |
| 2005 | 18 | 30 |
| 2006 | 12 | 19 |
| 2007 | 14 | 18 |
| 2008 | 8 | 43 |
| 2009 | 22 | 38 |
| 2010 | 15 | 26 |
| 2011 | 25 | 44 |
| 2012 | 21 | 28 |
| 2013 | 17 | 17 |
| 2014 | 26 | 18 |
| 2015 | 9 | 12 |
| 2016 | 9 | 9 |
| 2017 | 12 | 7 |
| 2018 | 9 | 5 |
| 2019 | 7 | 6 |
| 2020 | 5 | 1 |
| 2021 | 3 | 2 |
| 2022 | 0 | 2 |
| 2023 | 2 | 3 |
| 2024 | 1 | 3 |
| 2025 | 1 | 4 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Composite copper components17 Jun 2025US 12,336,116 B2Namics Corporation
- Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board24 Dec 2024US 12,177,972 B2Nof Corporation
- Multilayer wiring substrate, method of manufacturing same, and probe card having same26 Dec 2023US 11,852,655 B2Point Engineering Co., Ltd.
- Circuit board structure and manufacturing method thereof2 May 2023US 11,641,713 B2Unimicron Technology Corp.
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Multilayer body, capacitor, electrical circuit, circuit board, apparatus, and multilayer body manufacturing method6 Aug 2026US 2026/0229408 A1Panasonic Intellectual Property Management Co., Ltd.
- Circuit board and chip package comprising same2 Jul 2026US 2026/0190224 A1LG Innotek Co., Ltd.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed wiring board25 Dec 2025US 2025/0393124 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Etching method and etching apparatus343US 9,991,138 B2Tokyo Electron Limited · 2018
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994
- Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements205US 5,757,074 AHughes Electronics Corporation · 1998
- Components with conductive solder mask layers133US 6,329,605 B1Tessera, Inc. · 2001