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US 11,852,655 B2Granted
Multilayer wiring substrate, method of manufacturing same, and probe card having same
AssigneePoint Engineering Co., Ltd.
InventorsBum Mo Ahn, Seung Ho Park, Sung Hyun Byun
Life of this patent
Estimating the term…
Abstract
Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.
Claims8
A method of manufacturing a multilayer wiring substrate, the method comprising:
- manufacturing a unit anodic oxide film wiring substrate in such a manner that through-holes are formed by etching at least a part of an anodic oxide film, vertical wiring parts are formed by charging a metal material into the through-holes, a junction layer is formed on at least a side of the anodic oxide film, the junction layer is subjected to patterning, and horizontal wiring parts are formed on an upper surface of the patterned anodic oxide film so as to be connected to the vertical wiring parts each other, wherein the junction layer is provided around the horizontal wiring parts without a gap on the same plane in a single layer provided on the anodic oxide film;
- providing a plurality of unit anodic oxide film wiring substrates, the plurality of unit anodic oxide film wiring substrates including a first unit anodic oxide film wiring substrate, a second unit anodic oxide film wiring substrate, and a third unit anodic oxide film wiring substrate, and stacking the first, second, and third unit anodic oxide film wiring substrates from top to bottom;
- and
- joining the first, second, and third unit anodic oxide film wiring substrates stacked from top to bottom to each other by the junction layer,
- wherein the second unit anodic oxide film wiring substrate is provided on an upper portion of the first unit anodic oxide film wiring substrate, and the third unit anodic oxide film wiring substrate is provided on an upper portion of the second unit anodic oxide film wiring substrate, and
- wherein second vertical wiring parts of the second unit anodic oxide film wiring substrate have a wider pitch than first vertical wiring parts of the first unit anodic oxide film wiring substrate, and third vertical wiring parts of the third unit anodic oxide film wiring substrate have a wider pitch than the second vertical wiring parts of the second unit anodic oxide film wiring substrate.
3 more elements
A multilayer wiring substrate configured by joining unit anodic oxide film wiring substrates to each other from top to bottom by a junction layer, each of the unit anodic oxide film wiring substrates including vertical wiring parts passing through an anodic oxide film from top to bottom and horizontal wiring parts provided on an upper surface of the anodic oxide film so as to be connected to the vertical wiring parts each other,
- wherein each of the unit anodic oxide film wiring substrates comprises:
- a body part including the anodic oxide film having through-holes and the vertical wiring parts provided in the through-holes;
- and
- an upper layer part provided on an upper portion of the body part and including the horizontal wiring parts provided to be connected to the vertical wiring parts and the junction layer provided around the horizontal wiring parts,
- wherein the junction layer is provided around the horizontal wiring parts without a gap on the same plane in a single layer provided on the anodic oxide film,
- wherein the unit anodic oxide film wiring substrates include a first unit anodic oxide film wiring substrate, a second unit anodic oxide film wiring substrate, and a third unit anodic oxide film wiring substrate,
- wherein the first, second, and third unit anodic oxide film wiring substrates are stacked and joined from top to bottom to each other by the junction layer,
- wherein the second unit anodic oxide film wiring substrate is provided on an upper portion of the first unit anodic oxide film wiring substrate, and the third unit anodic oxide film wiring substrate is provided on an upper portion of the second unit anodic oxide film wiring substrate, and
- wherein second vertical wiring parts of the second unit anodic oxide film wiring substrate have a wider pitch than first vertical wiring parts of the first unit anodic oxide film wiring substrate, and third vertical wiring parts of the third unit anodic oxide film wiring substrate have a wider pitch than the second vertical wiring parts of the second unit anodic oxide film wiring substrate.
6 more elements
A probe card having a multilayer wiring substrate configured by joining unit anodic oxide film wiring substrates to each other from top to bottom by a junction layer, each of the unit anodic oxide film wiring substrates including vertical wiring parts passing through an anodic oxide film from top to bottom and horizontal wiring parts provided on an upper surface of the anodic oxide film so as to be connected to the vertical wiring parts each other, the probe card comprising:
- the unit anodic oxide film wiring substrates each including a body part including the anodic oxide film having through-holes and the vertical wiring parts provided in the through-holes, and an upper layer part provided on an upper portion of the body part and including the horizontal wiring parts provided to be connected to the vertical wiring parts and the junction layer provided around the horizontal wiring parts;
- a first connection pad provided on a lower portion of the joined unit anodic oxide film wiring substrates;
- a second connection pad provided on an upper portion of the joined unit anodic oxide film wiring substrates and electrically connected to a terminal of a printed circuit board (PCB) substrate;
- and
- a probe electrically connected to the first connection pad,
- wherein the junction layer is provided around the horizontal wiring parts without a gap on the same plane in a single layer provided on the anodic oxide film,
- wherein the unit anodic oxide film wiring substrates include a first unit anodic oxide film wiring substrate, a second unit anodic oxide film wiring substrate, and a third unit anodic oxide film wiring substrate,
- wherein the first, second, and third unit anodic oxide film wiring substrates are stacked and joined from top to bottom to each other by the junction layer,
- wherein the second unit anodic oxide film wiring substrate is provided on an upper portion of the first unit anodic oxide film wiring substrate, and the third unit anodic oxide film wiring substrate is provided on an upper portion of the second unit anodic oxide film wiring substrate,
- wherein second vertical wiring parts of the second unit anodic oxide film wiring substrate have a wider pitch than first vertical wiring parts of the first unit anodic oxide film wiring substrate, and third vertical wiring parts of the third unit anodic oxide film wiring substrate have a wider pitch than the second vertical wiring parts of the second unit anodic oxide film wiring substrate.
7 more elements
Dependencies are inferred from the claim text.