Back to results
US 2026/0229408 A1Published application
Multilayer body, capacitor, electrical circuit, circuit board, apparatus, and multilayer body manufacturing method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorManabu KANOU
Life of this patent
Estimating the term…
Abstract
A multilayer body includes metallic tantalum and a dielectric layer. The dielectric layer is in contact with the metallic tantalum, and includes an oxide containing tantalum and tungsten. The dielectric layer has a relative permittivity of more than 27 and 41.7 or less at 120 Hz.
Claims13
A multilayer body comprising:
- metallic tantalum;
- and
- a dielectric layer in contact with the metallic tantalum and including an oxide containing tantalum and tungsten, wherein
- the dielectric layer has a relative permittivity of more than 27 and 41.7 or less at 120 Hz.
1 more element
A capacitor comprising:
- a first electrode including metallic tantalum;
- a second electrode;
- and
- a dielectric layer disposed between the first electrode and the second electrode and including an oxide containing tantalum and tungsten, wherein
- the dielectric layer has a relative permittivity of more than 27 and 41.7 or less at 120 Hz.
2 more elements
A multilayer body manufacturing method comprising:
- bringing metallic tantalum into contact with an acidic solution containing a tungsten compound;
- and
- performing anodic oxidation of the metallic tantalum with the metallic tantalum in contact with the solution, wherein
- the solution satisfies at least one requirement selected from the group consisting of (i) and (ii) below:
- (i) the solution contains an electrolyte including a heteropoly tungstic acid or a heteropoly tungstate salt having an anion containing two or more tungsten atoms per molecule;
- and
- (ii) a concentration of the tungsten compound in the solution is 0.5 mass % or more.
4 more elements
Dependencies are inferred from the claim text.