Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board
AssigneeNof Corporation
InventorsToshinobu Fujimura, Katsumi Nakasato, Muneaki Iizuka
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Abstract
According to the present invention, a heat-dissipating circuit board is formed by providing a metal material adjacent to one surface of an insulating layer and providing a conductive metal layer to the other surface of the insulating layer. The metal material is a sheet of copper or a copper alloy or aluminum or an aluminum alloy and is 0.2-20 mm thick. The insulating layer is a metal oxide layer that has the composition AlxOyTz, is 0.2-30 μm thick, has a volume resistivity of at least 1000 GΩ·cm, and has a porosity of no more than 10%. The heat-dissipating circuit board has excellent heat-dissipation properties and insulation properties.
Claims12
A heat-dissipating circuit board comprising a metal material that is provided to be adjacent to one surface of an insulating layer and a conductive metal layer that is provided on the other surface of the insulating layer, wherein
- a material of the metal material is copper or a copper alloy or aluminum or an aluminum alloy, and the metal material has a sheet shape with a thickness of 0.2 mm or more and 20 mm or less, and
- the insulating layer is a metal oxide layer that is represented by a compositional formula:
- AlxOyTz,
- (where Al represents an aluminum atom, O represents an oxygen atom, T represents one atom or a plurality of atoms other than Al and O;
- x, y, and z denote a mass ratio, x+y+z=100, x is 30 or more and 60 or less, y is 40 or more and 70 or less, and z is 0 or more and 10 or less), and
- has a thickness of 0.2 μm or more and 30 μm or less, a volume resistivity of 1000 GΩ·cm or more, and a porosity of 10% or less.
Dependencies are inferred from the claim text.