Composite copper components
AssigneeNamics Corporation
InventorsNaoki Obata, Yoshinobu Kokaji, Makiko Sato
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Abstract
The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.
Claims15
A composite copper component comprising a copper oxide-containing layer formed on at least a portion of the surface of a copper component, wherein
- when the surface of the composite copper component is bonded to a resin substrate by thermocompression under given conditions, and the copper component is peeled off from the resin substrate under given conditions after the thermocompression bonding, a metal atom contained in the copper oxide-containing layer is detected from a surface of the resin substrate from which the copper component has been peeled off in an X-ray photoelectron spectrum obtained by an X-ray photoelectron spectroscopy (XPS) analysis with a survey spectrum, and
- wherein a sum of intensities of main peaks of metal elements detected from the surface of the resin substrate from which the copper component has been peeled off is greater than a peak intensity of C1s.
Dependencies are inferred from the claim text.