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US 2026/0190224 A1Published application
Circuit board and chip package comprising same
AssigneeLG Innotek Co., Ltd.
InventorsMyoung Lae ROH, Kab Young KIM, Min Sung JO
Life of this patent
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Abstract
A circuit board according to an embodiment comprises a first metal layer; and a second metal layer disposed on the first metal layer, wherein the first metal layer includes an oxide layer formed by oxidizing a region at a predetermined depth from a lower surface of the first metal layer, the first metal layer and the second metal layer include a plurality of electrode patterns disposed on the oxide layer and spaced apart from each other, and the oxide layer insulates between the plurality of electrode patterns.
Claims20
A circuit board comprising:
- a first metal layer;
- and
- a second metal layer disposed on the first metal layer,
- wherein the first metal layer includes an oxide layer formed by oxidizing a region at a predetermined depth from a lower surface of the first metal layer,
- wherein the first metal layer and the second metal layer include a plurality of electrode patterns disposed on the oxide layer and spaced apart from each other,
- wherein the oxide layer insulates between the plurality of electrode patterns, and
- wherein the oxide layer includes a region not overlapping the first metal layer along a thickness direction of the first metal layer.
4 more elements
A chip package comprising:
- an insulating layer including at least one through hole;
- a circuit pattern layer disposed on the insulating layer;
- an adhesive layer disposed under a lower surface of the insulating layer;
- an IC chip attached under the adhesive layer;
- and
- a connection member connecting a lower surface of the circuit pattern layer overlapping the through hole along a thickness direction of the insulating layer and the IC chip,
- wherein the circuit pattern layer includes:
- a first metal layer;
- and
- a second metal layer disposed on the first metal layer,
- wherein the first metal layer includes an oxide layer formed by oxidizing a region at a predetermined depth from a lower surface of the first metal layer, and
- wherein the oxide layer includes a region not overlapping the first metal layer along the thickness direction.
9 more elements
Dependencies are inferred from the claim text.