H05K 2203/0353
Making conductive layer thin
Official title: Making conductive layer thin, e.g. by etching
H05K2203/0353 (Making conductive layer thin) appears on 143 US grants and 158 published applications in this corpus.
Search patents in H05K- Granted patents
- 143
- Published applications
- 158
- Assignees
- 96
- Inventors
- 387
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 5 |
| 2002 | 5 | 6 |
| 2003 | 5 | 1 |
| 2004 | 8 | 10 |
| 2005 | 2 | 4 |
| 2006 | 2 | 15 |
| 2007 | 7 | 11 |
| 2008 | 9 | 23 |
| 2009 | 2 | 11 |
| 2010 | 11 | 7 |
| 2011 | 5 | 3 |
| 2012 | 7 | 6 |
| 2013 | 5 | 2 |
| 2014 | 3 | 8 |
| 2015 | 3 | 12 |
| 2016 | 5 | 4 |
| 2017 | 11 | 5 |
| 2018 | 6 | 5 |
| 2019 | 2 | 2 |
| 2020 | 5 | 2 |
| 2021 | 2 | 3 |
| 2022 | 2 | 3 |
| 2023 | 2 | 2 |
| 2024 | 2 | 3 |
| 2025 | 2 | 3 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro circuit structure and manufacturing method thereof1 Sep 2026US 12,727,077 B2Kinsus Interconnect Technology Corp.
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper7 Oct 2025US 12,439,528 B2Atotech Deutschland GmbH
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper4 Mar 2025US 12,245,383 B2Atotech Deutschland GmbH
- Wiring substrate and method for manufacturing wiring substrate12 Nov 2024US 12,144,121 B2Ibiden Co., Ltd.
- Redistribution plate28 May 2024US 11,997,789 B2
- Method of manufacturing multilayer pcb for semiconductor testing and multilayer pcb manufactured thereby27 Aug 2026US 2026/0255494 A1Tes Co., Ltd
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Micro circuit structure and manufacturing method thereof31 Jul 2025US 2025/0247954 A1Kinsus Interconnect Technology Corp.
- Polymer-conductor matrix electrical interconnect8 May 2025US 2025/0151204 A1
- Printed wiring board and method of manufacturing printed wiring board20 Feb 2025US 2025/0063651 A1Sumitomo Electric Industries, Ltd.
Most cited
By later US patents
- Printed wiring board and method for producing the same106US 6,715,204 B1Ibiden Co., Ltd. · 2004
- Method and structure for producing Z-axis interconnection assembly of printed wiring board elements81US 6,465,084 B1International Business Machines Corporation · 2002
- Multilayered printed circuit board and manufacturing method thereof56US 8,148,643 B2Ibiden Co., Ltd. · 2012
- Full additive process with filled plated through holes55US 6,664,485 B2International Business Machines Corporation · 2003
- Method for producing vias in the manufacture of printed circuit boards47US 6,240,636 B1Mitsui Mining & Smelting Co., Ltd. · 2001