H05K 2203/0384
Etch stop layer, i.e. a buried barrier layer for preventing etching of
Official title: Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
H05K2203/0384 (Etch stop layer, i.e. a buried barrier layer for preventing etching of) appears on 169 US grants and 170 published applications in this corpus.
Search patents in H05K- Granted patents
- 169
- Published applications
- 170
- Assignees
- 90
- Inventors
- 419
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 3 |
| 2002 | 6 | 8 |
| 2003 | 11 | 8 |
| 2004 | 7 | 10 |
| 2005 | 6 | 11 |
| 2006 | 5 | 11 |
| 2007 | 9 | 13 |
| 2008 | 6 | 14 |
| 2009 | 10 | 20 |
| 2010 | 8 | 7 |
| 2011 | 13 | 6 |
| 2012 | 7 | 7 |
| 2013 | 10 | 6 |
| 2014 | 5 | 9 |
| 2015 | 3 | 6 |
| 2016 | 7 | 8 |
| 2017 | 3 | 7 |
| 2018 | 7 | 2 |
| 2019 | 4 | 0 |
| 2020 | 1 | 3 |
| 2021 | 2 | 3 |
| 2022 | 0 | 0 |
| 2023 | 2 | 0 |
| 2024 | 0 | 5 |
| 2025 | 2 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board structure and manufacturing method thereof10 Feb 2026US 12,550,246 B2Unimicron Technology Corp.
- Circuit board and method for manufacturing the same, functional backplate, backlight module and display apparatus14 Oct 2025US 12,446,151 B2Boe Technology Group Co., Ltd.
- Production method for multilayer wiring board13 May 2025US 12,302,504 B2Mitsui Mining & Smelting Co., Ltd.
- Flexible electronic structure and method for producing same7 Nov 2023US 11,812,559 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board7 Feb 2023US 11,576,267 B2Mitsui Mining & Smelting Co., Ltd.
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Circuit board, manufacturing method thereof, and electronic component package including the same2 Oct 2025US 2025/0311107 A1Samsung Electro-Mechanics Co., Ltd.
- Component Carrier With Cavity and Laser Protection Structure28 Aug 2025US 2025/0273593 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board and method for manufacturing the same, functional backplate,backlight module and display apparatus1 Aug 2024US 2024/0260185 A1Boe Technology Group Co., Ltd.
- Multi-hundred or thousand channel electrode electrophysiological array and fabrication method11 Jul 2024US 2024/0226565 A9The Regents of the University of California
Most cited
By later US patents
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Etching of metallic composite articles159US 6,468,439 B1BMC Industries, Inc. · 2002
- Circuit manufacturing using etched tri-metal media125US 6,365,057 B1BMC Industries, Inc. · 2002
- Lamination of circuit sub-elements while assuring registration120US 6,409,930 B1BMC Industries, Inc. · 2002
- Method of making multilayered substrate for semiconductor device101US 6,418,615 B1Shinko Electronics Industries, Co., Ltd. · 2002