Production method for multilayer wiring board

A method of manufacturing a multilayer wiring board, comprising:

• providing a laminated sheet including, in sequence,
• a substrate composed of glass or ceramic,
• an adhesive metal layer and/or an auxiliary release layer,
• a first release layer, the first release layer being composed of carbon, and
• a metal layer;
• forming a first wiring layer on the metal layer;
• alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer, the first wiring layer being incorporated in the form of an embedded wiring layer;
• stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminated sheet, while interposing a second release layer exhibiting a higher release strength than that of the first release layer;
• separating the substrate from the metal layer at the first release layer;
• and
• separating the reinforcing sheet from the laminate provided with the multilayer wiring layer at the second release layer to give the multilayer wiring board;
• wherein the metal layer comprises
• a power supply sublayer enabling power supply to the first wiring layer, and
• an antireflection sublayer on a surface of the power supply sublayer adjacent to the first release layer, wherein the antireflection sublayer is composed of at least one metal selected from the group consisting of Cr and Ti;
• wherein the adhesive metal layer is composed of at least one metal selected from the group consisting of Ti, Cr and Ni, and
• wherein the auxiliary release layer is composed of copper.