H05K 2203/0338
Transferring metal or conductive material other than a circuit pattern
Official title: Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
H05K2203/0338 (Transferring metal or conductive material other than a circuit pattern) appears on 454 US grants and 256 published applications in this corpus.
Search patents in H05K- Granted patents
- 454
- Published applications
- 256
- Assignees
- 206
- Inventors
- 968
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 6 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 5 | 0 |
| 1991 | 9 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 10 | 0 |
| 1995 | 11 | 0 |
| 1996 | 11 | 0 |
| 1997 | 14 | 0 |
| 1998 | 23 | 0 |
| 1999 | 30 | 0 |
| 2000 | 43 | 0 |
| 2001 | 38 | 13 |
| 2002 | 25 | 24 |
| 2003 | 27 | 14 |
| 2004 | 10 | 15 |
| 2005 | 14 | 20 |
| 2006 | 11 | 19 |
| 2007 | 10 | 16 |
| 2008 | 6 | 21 |
| 2009 | 11 | 32 |
| 2010 | 17 | 12 |
| 2011 | 18 | 10 |
| 2012 | 9 | 3 |
| 2013 | 3 | 7 |
| 2014 | 7 | 2 |
| 2015 | 3 | 6 |
| 2016 | 0 | 2 |
| 2017 | 6 | 1 |
| 2018 | 1 | 0 |
| 2019 | 5 | 9 |
| 2020 | 5 | 8 |
| 2021 | 6 | 6 |
| 2022 | 5 | 2 |
| 2023 | 4 | 5 |
| 2024 | 2 | 2 |
| 2025 | 2 | 2 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Method for forming wiring on semiconductor device16 Dec 2025US 12,500,121 B2CONNECTEC JAPAN Corporation
- Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump11 Mar 2025US 12,246,398 B2Resonac Corporation
- Methods for printing a conductive pillar with high precision10 Sep 2024US 12,089,343 B2Reophotonics, Ltd.
- Method to electrically connect chip with top connectors using 3D printing23 Jul 2024US 12,046,575 B2IO Tech Group Ltd.
- Memory device with emi shield1 Oct 2026US 2026/0304600 A1Micron Technology, Inc.
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Carrier for laser induced forward transfer and transfer apparatus comprising the same13 Aug 2026US 2026/0233341 A1Nexperia B. V.
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Pattern recognition system and method for digital printed circuit board assembly9 Jul 2026US 2026/0197945 A1National Technical University of Athens
Most cited
By later US patents
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Solder bump transfer device for flip chip integrated circuit devices189US 5,607,099 ADelco Electronics Corporation · 1997
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998